http://caligraph.org/ontology/Integrated_circuit_packaging_type

CaLiGraph

Property	Value
rdf:type	owl:Class
rdfs:label	Integrated circuit packaging type
rdfs:subClassOf	owl:Thing
prov:wasDerivedFrom	http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types
is rdf:type of	WSI Small outline integrated circuit -ULGA Ceramic DIP WSON Plastic DIP Dual in-line package Pin grid array Multi-chip module Chip carrier Flatpack (electronics) Small-outline transistor Land grid array Thin shrink small outline package CHIP (programming language) DO-214AA Chip-scale package Metal (API) Ceramic column grid array DPAK Chemi-Con D Molded DIP Ball grid array Sif dBASE package LLP Panasonic G SOD-123 OBGA Metal can Ceramic Flatpack EIA Skinny DIP Small-outline package, J-leaded CERPACK LTCC Quad flat package Panasonic Zig-zag in-line package CDE Cornell Dubilier MicroMELF CQGP TVSOP Proximity communication TO-3 Thin small outline package ChIP-on-chip PLC Chip-on-glass Panasonic E/F Power quad flat no-lead SSOP Chip-on-flex Panel-mount BPS Pull SIP Chip-on-wire Micro leadframe package Shrink DIP

About: clgo:Integrated_circuit_packaging_type